Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip
An optoelectronic semiconductor chip includes a semiconductor body including a first semiconductor region, a second semiconductor region and an active zone disposed between the first and second semiconductor regions, an electrically conductive contact layer arranged on a side of the first semiconductor region facing away from the second semiconductor region, and an electrically conductive mirror layer arranged between the first semiconductor region and the electrically conductive contact layer, and laterally protruding at the edge by the first semiconductor region and the electrically conductive contact layer so that between the first semiconductor region and the electrically conductive contact layer there is an interspace in which a protective layer is arranged for protecting the mirror layer, wherein the electrically conductive contact layer extends laterally to an edge of the first semiconductor region, and the electrically conductive contact layer consists of Ni.
1. An optoelectronic semiconductor chip comprising:
a semiconductor body comprising a first semiconductor region, a second semiconductor region and an active zone disposed between the first and second semiconductor regions,
an electrically conductive contact layer arranged on a side of the first semiconductor region facing away from the second semiconductor region, and
an electrically conductive mirror layer arranged between the first semiconductor region and the electrically conductive contact layer, and the first semiconductor region and the electrically conductive contact layer laterally protrude at the edge of the electrically conductive mirror layer so that between the first semiconductor region and the electrically conductive contact layer there is an interspace in which a protective layer is arranged for protecting the mirror layer, wherein
the electrically conductive contact layer extends laterally to an edge of the first semiconductor region, and the electrically conductive contact layer consists of Ni.
2. The optoelectronic semiconductor chip according to claim 1 , wherein the electrically conductive mirror layer contains Ag or consists of Ag.
3. The optoelectronic semiconductor chip according to claim 1 , wherein the protective layer at least partially fills the interspace and does not project laterally beyond the electrically conductive contact layer.
4. The optoelectronic semiconductor chip according to claim 1 , wherein the protective layer is formed of an electrically weakly conductive or insulating material and/or contains one of SiO 2 and Al 2 O 3 .
5. The optoelectronic semiconductor chip according to claim 1 , wherein a connecting layer formed of a transparent electrically conductive oxide is arranged between the electrically conductive mirror layer and the electrically conductive contact layer.
6. The optoelectronic semiconductor chip according to claim 1 , further comprising a further mirror layer arranged on a side of the electrically conductive contact layer facing away from the semiconductor body, wherein the further mirror layer extends laterally beyond the electrically conductive contact layer and covers at least one side surface of the semiconductor body.
7. The optoelectronic semiconductor chip according to claim 6 , further comprising at least one contact element for electrically contacting the electrically conductive contact layer, wherein the contact element is arranged in an opening of the further mirror layer.
8. The optoelectronic semiconductor chip according to claim 1 , wherein a planarization laterally surrounds the semiconductor body, the electrically conductive mirror layer and the electrically conductive contact layer.
9. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor body comprises a cross-sectional shape that widens from the first semiconductor region to the second semiconductor region.
10. The optoelectronic semiconductor chip according to claim 1 , wherein the second semiconductor region has a connection layer that confines the semiconductor body on its side of the second semiconductor region facing away from the first semiconductor region and comprises a highest doping in the semiconductor body.