Optoelectronic semiconductor chip and method for the production thereof

1. A method for producing an optoelectronic semiconductor chip, the method comprising:

providing a substrate;

growing a first layer, wherein the first layer includes a plurality of first sublayers with a first indium content, and a plurality of second sublayers with a second indium content, and wherein the first layer comprises successive first sublayers and second sublayers alternating one another;

after growing the first layer, performing an etching process to initiate V-defects, wherein the etching process creates an opening in at least one first sublayer and at least one second sublayer, the opening extending completely through the at least one first sublayer and the at least one second sublayer;

after performing the etching process, growing a second layer; and

after growing the second layer, growing a quantum film structure,

wherein an active layer of the optoelectronic semiconductor chip is disposed in the quantum film structure, and

wherein, with respect to the plurality of first sublayers, each successive first sublayer has a degree of doping that is diminished relative to a degree of doping of a prior first sublayer, in a direction toward the second layer.

2. The method according to claim 1 ,

wherein growing the first layer comprises growing a first sublayer of the plurality of first sublayers and a second sublayer of the plurality of second sublayers,

wherein an opening is created in the first sublayer, which is grown, during the etching process, and

wherein the opening extends completely through the first sublayer, where the opening is created.

3. The method according to claim 1 , wherein growing the first layer comprises growing the plurality of first sublayers and the plurality of second sublayers, and wherein the plurality of first sublayers have a different aluminum content or a different indium content than the plurality of second sublayers.

4. The method according to claim 3 , wherein the plurality of first sublayers are grown with the first indium content, and the plurality of second sublayers are grown with the second indium content, the first indium content being at least as high as the second indium content.

5. The method according to claim 1 , wherein the etching process is carried out within an epitaxy facility.

6. The method according to claim 5 , wherein growth is interrupted during the etching process, and wherein hydrogen is supplied to the epitaxy facility during the etching process.

7. The method according to claim 1 , wherein the etching process is carried out outside an epitaxy facility.

8. The method according to claim 4 , wherein the first indium content in each first sublayer of the plurality of first sublayers amounts to between 0% and 12%.

9. The method according to claim 8 , wherein the second indium content in each second sublayer of the plurality of second sublayers amounts to at most 6%.

10. The method according to claim 1 , wherein the first layer comprises between 2 and 100 first sublayers.

11. The method according to claim 1 , wherein the second layer has a thickness of between 1 nm and 120 nm.

12. The method according to claim 1 , wherein each first sublayer of the plurality of first sublayers has a thickness of between 0.5 nm and 10 nm, and each second sublayer of the plurality of second sublayers has a thickness of between 0.5 nm and 30 nm.

13. A method for producing an optoelectronic semiconductor chip, the method comprising:

providing a substrate;

growing a first layer including a plurality of first sublayers and a plurality of second sublayers, the first sublayers having a different aluminum concentration or a different indium content than the second sublayers, wherein the first sublayers are grown with a first indium content and the second sublayers are grown with a second indium content, the first indium content being at least as high as the second indium content, wherein the first sublayers and the second sublayers alternating one another;

performing an etching process to initiate V-defects, wherein an opening is created in at least one first sublayer and at least one second sublayer during the etching process, the opening extending completely through the at least one first sublayer and the at least one second sublayer;

growing a second layer on the first layer; and

growing a quantum film structure on the second layer, wherein the quantum film structure has a third indium content that is higher than the first indium content,

wherein the second layer and the quantum film structure are grown in a region of the V-defects.

14. The method according to claim 13 , wherein the first indium content amounts to between 0% and 12%.

15. The method according to claim 14 , wherein the second indium content amounts to at most 6%.

16. The method according to claim 13 , wherein the second layer has a thickness of between 1 nm and 120 nm.

17. The method according to claim 13 , wherein the first sublayer has a thickness of between 0.5 nm and 10 nm and the second sublayer has a thickness of between 0.5 nm and 30 nm.

18. A method for producing an optoelectronic semiconductor chip, the method comprising:

providing a substrate;

growing a first layer, wherein the first layer includes a plurality of first sublayers with a first indium content, and a plurality of second sublayers with a second indium content, and wherein the first layer comprises successive first sublayers and second sublayers alternating one another;

after growing the first layer, performing an etching process to initiate V-defects, wherein an opening is created in several first sublayers during the etching process, the opening extending completely through the several first sublayers;

after performing the etching process, growing a second layer; and

after growing the second layer, growing a quantum film structure,

wherein an active layer of the optoelectronic semiconductor chip is disposed in the quantum film structure.