Component for displaying a pictogram and method of producing a component
A component includes a carrier, a semiconductor body and a mirror layer located therebetween, wherein the semiconductor body includes an active layer configured to generate light during operation of the component, the component has a main surface that illuminates during operation, wherein luminous areas of the main surface represent visually detectable information as a pictogram, in a plan view of the main surface, the pictogram has a contour at least partially defined by a contour of the mirror layer, and in a plan view of the main surface, the component has an outline different from the contour of the pictogram.
1. A component comprising a carrier, a semiconductor body and a mirror layer located therebetween, wherein
the semiconductor body comprises an active layer configured to generate light during operation of the component,
the component has a main surface that illuminates during operation, wherein luminous areas of the main surface represent visually detectable information as a pictogram,
in a plan view of the main surface, the pictogram has a contour at least partially defined by a contour of the mirror layer, and
in a plan view of the main surface, the component has an outline different from the contour of the pictogram.
2. The component according to claim 1 , wherein, in a plan view of the main surface, the semiconductor body and the pictogram have the same outer contours.
3. The component according to claim 1 , wherein, in a plan view of the main surface, the semiconductor body and the pictogram have different outer contours.
4. The component according to claim 1 , wherein, in a plan view of the main surface, the mirror layer and the pictogram have the same outer contours.
5. The component according to claim 1 , further comprising a frame structure that, in a plan view of the main surface, at least partially surrounds at least one of the mirror layer and the pictogram laterally.
6. The component according to claim 5 , wherein the frame structure is formed at least in regions as a contact structure for electrically contacting a first semiconductor layer of the semiconductor body, and the active layer is arranged in the vertical direction between the first semiconductor layer and the mirror layer.
7. The component according to claim 6 , wherein the semiconductor body comprises a second semiconductor layer, the active layer is arranged between the first semiconductor layer and the second semiconductor layer, and the contact structure extends vertically from the carrier to the first semiconductor layer.
8. The component according to claim 5 , wherein the frame structure is formed at least partially from a radiation-absorbing material.
9. The component according to claim 1 , further comprising a through-via extending throughout the mirror layer and the active layer to electrically contact a first semiconductor layer of the semiconductor body.
10. The component according to claim 1 , wherein
in a plan view of the carrier, the semiconductor body completely covers the mirror layer and has an outer contour different from the outer contour of the mirror layer, and
an electrically non-contactable material is arranged at least on edge-side regions of the semiconductor body not covered by the mirror layer.
11. The component according to claim 1 , wherein
the carrier has a metallic carrier layer, a first through-contact and a second through-contact,
the first through-contact is laterally spaced from the second through-contact by an intermediate region, and
in a plan view of the main surface, the metallic carrier layer laterally bridges the intermediate region.
12. The component according to claim 11 , wherein the carrier has an electrically insulating shaped body laterally enclosing the first through-contact and the second through-contact and fills the intermediate region.
13. The component according to claim 1 , formed as an optoelectronic radiation-emitting semiconductor chip, wherein the component has the carrier as the only carrier of the semiconductor chip.
14. The component according to claim 1 , wherein the pictogram is a sign or a series of signs selected from the group consisting of letters, numbers, everyday symbols, figurative marks, company logos, warning signs, letter characters, traffic signs, prohibition signs and information signs.
15. The component according to claim 1 , wherein an optical element is disposed on the semiconductor body, and the optical element is configured to project the pictogram.
16. A method of producing the component as claimed in claim 1 or a plurality of the components,
wherein at a wafer level, the semiconductor body is structured such that the mirror layer and the semiconductor body have the same outer contours that define the contour of the pictogram to be displayed.
17. A method of producing the component as claimed in claim 1 or a plurality of the components, wherein
the mirror layer is configured to electrically contact the semiconductor body of the component to be produced and at wafer level is formed such that the mirror layer has an outer contour defining the contour of the pictogram to be displayed,
in a plan view of the carrier, the semiconductor body completely covers the mirror layer and has an outer contour different from the outer contour of the mirror layer, and
an electrically non-contactable material is applied at least to edge-side regions of the semiconductor body not covered by the mirror layer.
18. A method of producing the component as claimed in claim 1 or a plurality of the components,
wherein a surface of the semiconductor body facing the carrier is electrically inactivated in regions to define the contour of the pictogram.