Radiation-emitting component and method for producing a radiation-emitting component
A radiation emitting component and a method for producing a radiation emitting component are disclosed. In an embodiment a radiation emitting component includes a radiation emitting semiconductor chip having an active zone configured to generate electromagnetic radiation of a first wavelength range, a reflector having side walls and a bottom surface and a conversion layer comprising a first phosphor configured to convert the electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, wherein the conversion layer is located at the side walls of the reflector, wherein the conversion layer has a cross-sectional area, which decreases from the bottom surface of the reflector to a radiation exit surface of the component, and wherein the reflector is filled with a conversion element comprising a second phosphor configured to convert electromagnetic radiation of the first wavelength range into electromagnetic radiation of a third wavelength range.
1. A radiation emitting component comprising:
a radiation emitting semiconductor chip having an active zone configured to generate electromagnetic radiation of a first wavelength range;
a reflector having side walls and a bottom surface; and
a conversion layer comprising a first phosphor configured to convert the electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range,
wherein the conversion layer is located at the side walls of the reflector,
wherein the conversion layer has a cross-sectional area, which decreases from the bottom surface of the reflector to a radiation exit surface of the component,
wherein the reflector is filled with a conversion element comprising a second phosphor configured to convert the electromagnetic radiation of the first wavelength range into electromagnetic radiation of a third wavelength range,
wherein the conversion layer comprises a first silicone resin, in which particles of the first phosphor are incorporated,
wherein the conversion element comprises a second silicone resin, and
wherein a refractive index of the first silicone resin is smaller than a refractive index of the second silicone resin.
2. The radiation emitting component according to claim 1 , wherein the conversion layer has an inclined outer surface which includes an angle between 10° and 70° inclusive, with a normal of the bottom surface.
3. The radiation emitting component according to claim 1 , wherein a grain size of the first phosphor is smaller than a grain size of the second phosphor.
4. The radiation emitting component according to claim 1 , wherein the first phosphor is configured to convert blue radiation into red radiation.
5. The radiation emitting component according to claim 1 , wherein the first phosphor is formed as particles with a grain size between 5 micrometer and 20 micrometer inclusive.
6. The radiation emitting component according to claim 1 , wherein the first silicone resin has a refractive index between 1.3 and 1.45 inclusive for light having a wavelength of about 450 nanometers.
7. The radiation emitting component according to claim 1 , wherein the second phosphor is configured to convert blue radiation into green radiation.
8. The radiation emitting component according to claim 1 , wherein the second phosphor is formed as particles with a grain size between 8 micrometer and 40 micrometer inclusive.
9. The radiation emitting component according to claim 1 , wherein the second silicone resin has a refractive index between 1.55 and 1.7 inclusive for light having a wavelength of about 450 nanometers.
10. The radiation emitting component according to claim 1 , wherein the bottom surface of the reflector is also covered with the conversion layer.
11. The radiation emitting component according to claim 1 , wherein the semiconductor chip has a radiation transmissive carrier, to which an epitaxial semiconductor layer sequence is applied, and wherein the epitaxial semiconductor layer sequence comprises the active zone configured to also emit the electromagnetic radiation via side surfaces of the carrier.
12. A method for manufacturing a radiation emitting component, the method comprising:
providing a reflector having side walls and a bottom surface;
coating the side walls with a conversion layer, wherein the conversion layer has a cross-sectional area which decreases from the bottom surface of the reflector to a radiation exit surface of the component; and
fixing a radiation emitting semiconductor chip to the bottom surface,
wherein coating the side walls of the reflector with the conversion layer, fixing the semiconductor chip to the bottom surface, and coating the bottom surface with the conversion layer are performed in the specified order.
13. The method according to claim 12 , wherein coating the side walls of the reflector with the conversion layer comprises coating by injection or casting.
14. The method according to claim 12 , wherein the conversion layer is formed from several individual layers.
15. The method according to claim 12 , further comprising filling the reflector with a conversion element.