Method of producing optoelectronic components and optoelectronic component
A method of producing an optoelectronic component includes providing a carrier, generating a plurality of recesses in the carrier, applying a plurality of drops of a cover material to the carrier, introducing an optoelectronic semiconductor chip including a semiconductor body and contact elements on an underside of the semiconductor body into at least some of the drops, and curing the drops of the cover material into cover bodies, wherein at least some of the drops are completely surrounded by recesses in the carrier, and the recesses in the carrier are a stop edge for the cover material during introduction of the optoelectronic semiconductor chip.
1. A method of producing an optoelectronic component comprising:
providing a carrier,
generating a plurality of recesses in the carrier,
applying a plurality of drops of a cover material to the carrier,
introducing an optoelectronic semiconductor chip comprising a semiconductor body and contact elements on an underside of the semiconductor body into at least some of the drops, and
curing the drops of the cover material into cover bodies, wherein
at least some of the drops are completely surrounded by recesses in the carrier,
the recesses in the carrier are a stop edge for the cover material during introduction of the optoelectronic semiconductor chip, and
a shape of an outer surface of the cover material is the same on each side of the optoelectronic semiconductor chip after the semiconductor chip is introduced.
2. The method according to claim 1 , wherein an edge on the underside of the semiconductor body is a further stop edge for the cover material.
3. The method according to claim 1 , wherein a shape of an outer surface of the cover body is adjustable by changing at least one value: relation of volume of the cover material to volume of the semiconductor body, distance of a side surface of the semiconductor body to the closest recess, viscosity of the cover material, material and surface condition of the carrier.
4. The method according to claim 1 , wherein the recesses partially penetrate the carrier.
5. The method according to claim 1 , wherein the recesses completely penetrate the carrier.
6. The method according to claim 1 , wherein a further cover body is arranged on the outer surfaces of the cover body, on the underside of the semiconductor body and on an underside of the carrier.
7. The method according to claim 1 , wherein the carrier is detached from the optoelectronic semiconductor chip.
8. The method according to claim 1 , wherein a further carrier is applied to an upper side of the optoelectronic semiconductor chip facing away from the underside.
9. The method according to claim 1 , wherein a recess is arranged between all directly adjacent drops.
10. The method according to claim 1 , wherein the drops are not in direct contact to every stop edge during application of the drops.