IP Library Granted Patent US 11,245,246
Granted Patent B2
US 11,245,246 · App. 16/308,985 · Granted Feb 8, 2022

Semiconductor laser diode

Inventor: Wolfgang Reill (Pentling, DE)
Assignee: OSRAM OLED GmbH
H01S5/0237H01S5/023H01S5/0233H01S5/0234H01S5/0235H01S5/04254H01S5/0653H01S5/02461H01S5/02469H01S2301/176
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,245,246
App. No.
16/308,985
Granted
Feb 8, 2022
Kind
B2
Abstract

A semiconductor laser diode includes a semiconductor body having an emitter region; and a first connection element that electrically contacts the semiconductor body in the emitter region, wherein the semiconductor body is in contact with the first connection element in the emitter region, and at least in places in the emitter region, the semiconductor body has a structuring that enlarges a contact area between the semiconductor body and the first connection element.

Claims (31)

1. A semiconductor laser diode comprising:

a semiconductor body having an emitter region; and

a first connection element that electrically contacts the semiconductor body in the emitter region, the first connection element comprises a metallic layer,

wherein

the semiconductor body is in contact with the first connection element in the emitter region,

at least in places in the emitter region, the semiconductor body has a structuring that enlarges a contact area between the semiconductor body and the first connection element,

the structuring has a density of structures and the density of the structures increases toward a radiation exit surface,

the structuring comprises a plurality of structures, and

the closer the structures are to the radiation exit surface, the smaller a distance (d) is between neighboring structures.

2. The semiconductor laser diode according to claim 1 , wherein

the structuring has a density of structures, wherein the density of the structures increases towards a radiation exit surface,

the semiconductor body comprises a subregion arranged laterally adjacent to the emitter region,

at least in places in the subregion, the semiconductor body has a further structuring comprising further structures, wherein the further structuring is configured to weaken secondary modes, and

the structures of the structuring have a mean height (h) that is smaller than a mean height (h) of the further structures of the further structuring.

3. The semiconductor laser diode according to claim 2 , wherein the further structures are etched.

4. The semiconductor laser diode according to claim 1 , wherein at least in places, the contact area having the structuring located between the semiconductor body and the first connection element is at least 1.5 times as large as a contact area free of any structuring and located between the semiconductor body and the connection element.

5. The semiconductor laser diode according to claim 1 , wherein the connection layer comprising the metallic layer completely covers the semiconductor body in the emitter region.

6. The semiconductor laser diode according to claim 1 , wherein at least in places, the structuring comprises at least one structure selected from the group consisting of truncated cone, inverse truncated cone, truncated pyramid, inverse truncated pyramid, cone, inverse cone, pyramid, inverse pyramid, spherical shell and inverse spherical shell.

7. The semiconductor laser diode according to claim 1 , wherein a maximum lateral extension of each of the structures is at least 400 nm.

8. The semiconductor laser diode according to claim 1 , wherein, in the emitter region, the semiconductor body comprises a connection region directly adjoining the first connection element at the contact area, and the connection region is not completely pierced at any point.

9. The semiconductor laser diode according to claim 1 , wherein the semiconductor body comprises a subregion arranged laterally adjacent to the emitter region, and at least in places in the subregion, the semiconductor body has a further structuring comprising further structures, said further structuring being configured to weaken secondary modes.

10. The semiconductor laser diode according to claim 9 , wherein an electrically insulating insulation element is arranged between the subregion and the first connection element and in the subregion completely covers the semiconductor body on its side facing the first connection element.

11. The semiconductor laser diode according to claim 9 , wherein the structures of the structuring have a mean height (h) that is smaller than a mean height (h) of the further structures of the further structuring.

12. The semiconductor laser diode according to claim 1 , wherein the structures are etched.

13. A semiconductor laser diode comprising:

a semiconductor body having an emitter region; and

a first connection element that electrically contacts the semiconductor body in the emitter region, the first connection element comprises a metallic layer,

wherein

the semiconductor body is in contact with the first connection element in the emitter region,

at least in places in the emitter region, the semiconductor body has a structuring that enlarges a contact area between the semiconductor body and the first connection element, and

the structuring has a density of structures and the density of the structures increases toward a radiation exit surface.

Assignments (3)
MERGER Recorded Feb 17, 2026
From: OSRAM OLED GMBH
To: AMS-OSRAM INTERNATIONAL GMBH
Reel/Frame 074881/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2019
From: REILL, WOLFGANG
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 048047/0735 →