Optoelectronic device and method of producing an optoelectronic device
An optoelectronic device includes at least one optoelectronic semiconductor chip that emits radiation, at least one metallic reflecting surface, at least one functional component having a component surface different from the metallic reflecting surface, and a barrier layer stack for protection against corrosive gases arranged both on the at least one metallic reflecting surface and the component surface, wherein the barrier layer stack includes at least one inorganic oxide, oxynitride or nitride layer and at least one plasma-polymerized siloxane layer.
1. An optoelectronic device comprising:
at least one optoelectronic semiconductor chip that emits radiation,
at least one metallic reflecting surface,
at least one functional component having a component surface different from the metallic reflecting surface, and
a barrier layer stack for protection against corrosive gases arranged both on the at least one metallic reflecting surface and the component surface,
wherein the barrier layer stack comprises at least one inorganic oxide, oxynitride or nitride layer and at least one plasma-polymerized siloxane layer.
2. The optoelectronic device according to claim 1 , wherein a further plasma-polymerized siloxane layer is directly to arranged after both the at least one metallic reflecting surface and the component surface, and the inorganic oxide, oxynitride or nitride layer is subordinated to the further plasma-polymerized siloxane layer.
3. The optoelectronic device according to claim 2 , wherein the plasma-polymerized siloxane layer is to arranged after the inorganic oxide, oxynitride or nitride layer.
4. The optoelectronic device according to claim 1 , wherein the component surface is non-metallic.
5. The optoelectronic device according to claim 1 , wherein the functional component is the semiconductor chip, a bonding wire, a carrier, a lead frame, an adhesive that mounts the semiconductor chip, an ESP semiconductor chip and/or a plastic housing.
6. The optoelectronic device according to claim 1 , wherein the inorganic oxide, oxynitride or nitride layer comprises oxides, oxynitrides or nitrides of one or more elements selected from the group consisting of silicon, aluminum, titanium, zinc, indium, tin, niobium, tantalum, hafnium, zirconium, yttrium and germanium.
7. The optoelectronic device according to claim 1 , wherein the plasma-polymerized siloxane layer is produced from a precursor selected from the group consisting of hexamethyldisiloxane, tetramethyldisiloxane and divinyltetramethyldisiloxane.
8. The optoelectronic device according to claim 1 , wherein the metallic reflecting surface is made of silver or a silver-containing alloy.
9. The optoelectronic device according to claim 1 , wherein the inorganic oxide, oxynitride or nitride layer has a layer thickness of 5 nm to 100 nm.
10. The optoelectronic device according to claim 1 , wherein the plasma-polymerized siloxane layer has a layer thickness of 5 nm to 2 μm.
11. The optoelectronic device according to claim 1 , wherein the barrier layer stack covers, at least in regions, the surfaces of a semiconductor chip, a contact and the housing.
12. The optoelectronic device according to claim 1 , wherein the inorganic oxide, oxynitride or nitride layer is directly subordinated both on the at least one metallic reflecting surface and the component surface, and the plasma-polymerized siloxane layer is arranged after the inorganic oxide, oxynitride or nitride layer.
13. The optoelectronic device according to claim 1 , wherein the plasma-polymerized siloxane layer forms the final layer of the barrier layer stack.
14. A method of producing an optoelectronic device comprising:
A) providing at least one optoelectronic semiconductor chip that emits radiation, at least one metallic reflecting surface and at least one functional component having a component surface different from the metallic reflecting surface, and
B) applying a barrier layer stack for protection against corrosive gases both on the at least one metallic reflecting surface and the component surface, wherein the barrier layer stack is formed by producing at least one inorganic oxide, oxynitride or nitride layer and at least one plasma-polymerized siloxane layer.
15. The method according to claim 14 , wherein, during deposition of the plasma-polymerized siloxane layer, one or more deposition parameters are varied as a result of which the plasma-polymerized siloxane layer has gradients.
16. The method according to claim 14 , wherein, prior to step B), the metallic reflecting surface and the component surface are treated by plasma.
17. The method according to claim 14 , wherein the barrier layer stack is applied after contacting an electrical contact.