IP Library Granted Patent US 11,101,412
Granted Patent B2
US 11,101,412 · App. 16/484,541 · Granted Aug 24, 2021

Method for producing an output coupling element for an optoelectronic component and output coupling element

Inventor: Georg Dirscherl (Regensburg, DE)
Assignee: OSRAM OLED GMBH
H01L33/502C09K11/0883C09K11/70H01L33/58H01L2933/0041H01L2933/0058
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Quick Facts
Patent No.
US 11,101,412
App. No.
16/484,541
Granted
Aug 24, 2021
Kind
B2
Abstract

A method for producing an output coupling element and an output coupling element are disclosed. In an embodiment a method includes producing a suspension having quantum dots in a suspension medium, wherein each quantum dot comprises a core having a semiconductor material, directly applying the suspension onto a surface of an optoelectronic component and/or onto a surface of a carrier and removing the suspension medium for producing the output coupling element, wherein the output coupling element is matrix-free and transparent to radiation of a red range and/or a IR range.

Claims (35)

1. A method for producing an output coupling element, the method comprising:

producing a suspension having quantum dots in a suspension medium, wherein each quantum dot comprises a core having a semiconductor material;

directly applying the suspension onto a surface of an optoelectronic component and/or onto a surface of a carrier; and

removing the suspension medium for producing the output coupling element, wherein the output coupling element is matrix-free and transparent to radiation of a red range and/or an IR range.

2. The method according to claim 1 , wherein the semiconductor material is selected from the group consisting of GaP, InP, GaAs and InGaAlP.

3. The method according to claim 1 , wherein the output coupling element consists essentially of the quantum dots.

4. The method according to claim 1 , wherein the semiconductor material is GaP or InP.

5. The method according to claim 1 , wherein the output coupling element is formed as a lens.

6. The method according to claim 1 , wherein the surface of the optoelectronic component is a surface of a conversion element or of a semiconductor layer sequence.

7. The method according to claim 1 , wherein the surface of the carrier is non-stick coated.

8. The method according to claim 1 , wherein the output coupling element is applied without an adhesive onto the surface of the optoelectronic component.

9. The method according to claim 1 , wherein the output coupling element is applied without an adhesive onto the surface of the carrier.

10. The method according to claim 1 , wherein the semiconductor material is GaP and is produced from gallium halide and an alkali phosphide.

11. The method according to claim 10 , wherein the gallium halide is a gallium chloride.

12. The method according to claim 10 , wherein the alkali phosphide is a sodium phosphide.

13. The method according to claim 1 , wherein directly applying the suspension comprises spin coating, spray coating or wet chemical depositing the suspension.

14. The method according to claim 1 , wherein the suspension has an amide as the suspension medium.

15. The method according to claim 1 , wherein the suspension medium is N,N-dimethylformamide.

16. An output coupling element produced according to claim 1 .

17. A method for producing an output coupling element, the method comprising:

producing a suspension having quantum dots in a suspension medium, wherein each quantum dot comprises a core having a semiconductor material;

directly applying the suspension onto a surface of an optoelectronic component and/or onto a surface of a carrier; and

removing the suspension medium for producing the output coupling element,

wherein the output coupling element is matrix-free and transparent to radiation of a red range and/or an IR range, and

wherein the output coupling element is formed as a lens.

18. A method for producing an output coupling element, the method comprising:

producing a suspension having quantum dots in a suspension medium, wherein each quantum dot comprises a core having a semiconductor material;

directly applying the suspension onto a surface of a carrier;

subsequently removing the suspension medium so that the output coupling element is produced directly on the surface of the carrier;

producing a further suspension comprising quantum dots as a layer on a surface of an optoelectronic component;

subsequently removing the carrier from the output coupling element; and

applying the output coupling element to the layer of quantum dots,

wherein the output coupling element is matrix-free and transparent to radiation of a red range and/or an IR range.

19. The method according to claim 18 , wherein the output coupling element is applied without an adhesive onto the surface of the optoelectronic component.

20. The method according to claim 18 , wherein the semiconductor material is GaP or InP, and wherein the suspension medium is N,N-dimethylformamide.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2019
From: DIRSCHERL, GEORG
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 050625/0736 →