IP Library Granted Patent US 10,741,993
Granted Patent B2
US 10,741,993 · App. 16/338,559 · Granted Aug 11, 2020

Laser component and method of producing a laser component

Inventors: Hubert Halbritter (Dietfurt-Toeging, DE); Andreas Wojcik (Regensburg, DE)
Assignee: OSRAM OLED GmbH
H01S5/02292G02B6/4214H01S5/0071H01S5/02228H01S5/02244H01S5/02252H01S5/02288H01S5/02296
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Quick Facts
Patent No.
US 10,741,993
App. No.
16/338,559
Granted
Aug 11, 2020
Kind
B2
Abstract

A laser component including a molded body, and a laser chip embedded into the molded body and configured to emit a laser beam in an emission direction, wherein a surface of the molded body includes a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section.

Claims (26)

1. A laser component comprising:

a molded body, and

a laser chip embedded into the molded body and configured to emit a laser beam in an emission direction,

wherein a surface of the molded body comprises a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section,

the laser component comprises a carrier, the laser chip is arranged at a top side of the carrier, and the molded body adjoins the top side of the carrier, and

the emission direction is oriented parallel to the top side of the carrier.

2. The laser component according to claim 1 , wherein the deflection section is formed at a side of the molded body facing the top side of the carrier, and the carrier comprises an opening in a region of the deflection section.

3. The laser component according to claim 1 , wherein the surface of the molded body comprises, at a side of the molded body facing away from the top side of the carrier, a bearing section parallel to the emission direction.

4. The laser component according to claim 1 , wherein the surface of the molded body comprises an emergence section, and a laser beam emitted by the laser chip and reflected at the deflection section emerges from the molded body through the emergence section.

5. The laser component according to claim 4 , wherein a laser beam emitted by the laser chip and reflected at the deflection section is refracted at the emergence section in a direction perpendicular to the emission direction.

6. The laser component according to claim 4 , wherein the emergence section constitutes an optical lens or a collimation lens.

7. The laser component according to claim 4 , wherein the emergence section comprises a roughening.

8. The laser component according to claim 3 , wherein the surface of the molded body comprises an emergence section, a laser beam emitted by the laser chip and reflected at the deflection section emerges from the molded body through the emergence section, and the bearing section delimits the emergence section.

9. The laser component according to claim 1 , wherein the molded body comprises a silicone.

10. A method of producing a laser component comprising:

providing a laser chip configured to emit a laser beam in an emission direction; and

forming a molded body,

wherein the laser chip is embedded into the molded body, and the molded body is formed with a surface comprising a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section, and

the molded body is formed by a molding method in a mold tool, transfer molding or compression molding, and the deflection section is formed at an extension of the mold tool.

11. The method according to claim 10 , further comprising:

providing a carrier; and

arranging the laser chip at a top side of the carrier; wherein the molded body is formed in a manner adjoining the top side of the carrier.

12. The method according to claim 10 , further comprising:

providing a carrier; and

arranging the laser chip at a top side of the carrier;

wherein the molded body is formed in a manner adjoining the top side of the carrier, the carrier is provided with an opening, and the extension of the mold tool projects through the opening of the carrier during the process of forming the molded body.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2019
From: HALBRITTER, HUBERT; WOJCIK, ANDREAS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 048819/0660 →