Sensor

1. A method of producing sensors, comprising:

providing a printed circuit board;

arranging semiconductor chips on the printed circuit board, wherein the semiconductor chips each comprising a front-side contact, and for each sensor, at least one radiation-detecting semiconductor chip is arranged on the printed circuit board;

applying an embedding material on the printed circuit board that forms an embedding layer, laterally adjoining the semiconductor chips;

forming contact layers connected to the front-side contacts of the respective semiconductor chips; and

singulating the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers into separate sensors, each sensor comprising a section of the printed circuit board, the at least one radiation-detecting semiconductor chip arranged on the section of the printed circuit board, and a section of the embedding layer arranged on the section of the printed circuit board and laterally adjoining the at least one semiconductor chip.

2. The method according to claim 1 ,

wherein the arranging of the semiconductor chips is carried out after providing the printed circuit board,

the applying of the embedding material is carried out after the arranging of the semiconductor chips,

the forming of the contact layers is carried out after the applying of the embedding material, and

the singulating of the printed circuit board is carried out after the forming of the contact layers.

3. The method according to claim 1 , wherein cutouts are formed in the embedding layer via which contact surfaces of the printed circuit board are at least partly uncovered, and the contact layers are formed such that the contact layers connect to the contact surfaces of the printed circuit board.

4. The method according to claim 1 , wherein electrical connection elements are arranged on contact surfaces of the printed circuit board, the embedding layer is formed in a manner laterally adjoining the electrical connection elements, and the contact layers are formed such that the contact layers connect to the electrical connection elements.

5. The method according to claim 1 , further comprising one of:

a radiation-transmissive material that forms optical elements applied on the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers; or

a radiation-transmissive material that forms optical elements applied on the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers, the optical elements are formed in the form of lenses, and a lens shape of the lenses is set by thixotropy and/or overhead curing.

6. The method according to claim 1 ,

wherein a radiation-nontransmissive material that forms at least one radiation-nontransmissive barrier structure is applied on the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers, and

the radiation-nontransmissive material is applied in the form of the at least one barrier structure.

7. The method according to claim 1 ,

wherein a radiation-nontransmissive material that forms at least one radiation-nontransmissive barrier structure is applied on the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers, and

the radiation-nontransmissive material is applied in the form of a layer and the layer is subsequently patterned into the at least one barrier structure.

8. The method according to claim 7 , wherein the radiation-nontransmissive material is a black photoresist material, and the patterning of the layer is carried out by exposure and development.

9. The method according to claim 7 , wherein a radiation-transmissive cover is arranged on the radiation-nontransmissive material.

10. The method according to claim 1 , wherein a radiation-transmissive material that forms a radiation-transmissive layer is applied on the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers.

11. The method according to claim 10 , wherein the radiation-transmissive layer is formed with a trench structure or a trench structure is formed in the radiation-transmissive layer, and a radiation-nontransmissive material that forms a radiation-nontransmissive barrier structure is applied in a region of the trench structure.

12. A method of producing sensors, comprising:

providing a printed circuit board;

arranging semiconductor chips on the printed circuit board, wherein the semiconductor chips comprise a front-side contact, and for each sensor, at least one radiation-detecting semiconductor chip is arranged on the printed circuit board;

applying an embedding material on the printed circuit board that forms an embedding layer, laterally adjoining the semiconductor chips;

forming contact layers connected to the front-side contacts of the respective semiconductor chips;

singulating the printed circuit board provided with the semiconductor chips, the embedding layer and the contact layers into separate sensors each comprising at least one radiation-detecting semiconductor chip, wherein the printed circuit board provided comprises electrical conductor structures comprising contact surfaces, and

the method further comprises one of:

forming cutouts in the embedding layer via which contact surfaces of the printed circuit board are at least partly uncovered, subsequently forming the contact layers such that the contact layers connect to the at least partly uncovered contact surfaces of the printed circuit board, and the front-side contacts of the semiconductor chips electrically connect to the at least partly uncovered contact surfaces of the printed circuit board via the contact layers; or

arranging electrical connection elements on contact surfaces of the printed circuit board, subsequently forming the embedding layer in a manner laterally adjoining the electrical connection elements, subsequently forming the contact layers such that the contact layers connect to the electrical connection elements and the front-side contacts of the semiconductor chips electrically connect to the contact surfaces of the printed circuit board, on which contact surfaces the electrical connection elements are arranged, via the contact layers and the electrical connection elements.