Method of producing an optoelectronic lighting device and optoelectronic lighting device
A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
1. A method of producing an optoelectronic lighting device comprising:
providing a laser chip carrier on which two edge emitting laser chips each comprising a laser facet are arranged with their respective laser facet opposite one another,
arranging a carrier comprising two optical elements situated opposite one another onto the laser chip carrier between the two laser facets such that after the arranging respectively one of the two optical elements faces one of the two laser facets,
forming a respective optical connection by an optical material between a respective laser facet and a respective optical element,
singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing comprises dividing the carrier between the two optical elements to form two mutually divided carrier parts each comprising one of the two optical elements,
such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
2. The method according to claim 1 , wherein the carrier is removed after the singulating.
3. The method according to claim 2 , wherein the carrier is formed from a soluble material, and the removing comprises dissolving the material.
4. The method according to claim 1 , wherein the carrier is formed as a frame enclosing an opening, and the two optical elements are each arranged on the carrier in a manner covering the opening.
5. The method according to claim 1 , wherein, to form the respective optical connection, the two laser chips and the carrier with the two optical elements are potted by an optical potting material such that the respective optical connection is formed by the optical potting material as optical material.
6. The method according to claim 1 , wherein after forming the optical connection and before singulating the two laser chips, the two laser chips, the carrier with the two optical elements and the respective optical connections are potted by a potting material.
7. The method according to claim 1 , wherein arranging the carrier onto the laser chip carrier comprises adhesively bonding the carrier onto the laser chip carrier by an adhesive.
8. The method according to claim 1 , wherein the two optical elements are each an element selected from the group consisting of spherical lens, aspherical lens, collimator lens, and cylindrical lens, that collimate a laser radiation emitted by the laser chip and which is polarized in a direction of a fast axis of the laser chip or in a direction of a slow axis of the laser chip.
9. The method according to claim 8 , wherein the carrier comprises two curvatures that respectively accommodate a lens curvature of the respective lens.