Leadframe, optoelectronic component having a leadframe, and method for producing an optoelectronic component
An optoelectronic component having a leadframe and a method for producing an optoelectronic component are disclosed. In an embodiment, an optoelectronic component includes a radiation-emitting semiconductor chip having a mounting surface and side surfaces, a leadframe comprising a first element having a first main extension plane, a second element having a second main extension plane, and a third element having a third main extension plane, wherein the main extension planes are arranged parallel to one another, and wherein the elements are arranged one above the other in a stacking direction; and a reflective casting compound forming a planar surface facing the mounting surface of the semiconductor chip, wherein the semiconductor chip is mounted with the mounting surface on a support surface of the third element, which is smaller than the mounting surface of the semiconductor chip, such that the semiconductor chip projects laterally beyond the support surface of the third element.
1. An optoelectronic component comprising:
a radiation-emitting semiconductor chip having a mounting surface and side surfaces;
a leadframe comprising:
a first element having a first main extension plane;
a second element having a second main extension plane, and
a third element having a third main extension plane,
wherein the first main extension plane, the second main extension plane and the third main extension plane are arranged parallel to one another, and
wherein the first element, the second element and the third element are arranged one above the other in a stacking direction; and
a reflective casting compound forming a planar surface facing the mounting surface of the semiconductor chip,
wherein the semiconductor chip is mounted with the mounting surface on a support surface of the third element, which is smaller than the mounting surface of the semiconductor chip, such that the semiconductor chip projects laterally beyond the support surface of the third element,
wherein the semiconductor chip is adhered with the mounting surface to the support surface,
wherein the side surfaces of the semiconductor chip are free of an adhesive,
wherein the leadframe is embedded in the reflective casting compound, and
wherein a gap is formed between the mounting surface of the semiconductor chip and the planar surface of the reflective casting compound.
2. The optoelectronic component according to claim 1 , wherein the mounting surface is at least 1 micrometer larger than the support surface of the third element.
3. The optoelectronic component according to claim 1 , wherein the semiconductor chip is arranged centered on the support surface of the third element.
4. The optoelectronic component according to claim 1 , wherein the semiconductor chip is configured to emit electromagnetic radiation during operation via a radiation exit surface and the side surfaces.
5. The optoelectronic component according to claim 1 , wherein the gap has a thickness between 1 micrometer and 145 micrometers inclusive.
6. The optoelectronic component according to claim 1 , wherein the planar surface of the reflective casting compound is arranged below and laterally of the semiconductor chip.
7. The optoelectronic component according to claim 1 , wherein the third element is formed as a pedestal and has a thickness between 5 micrometers and 150 micrometers inclusive.
8. The optoelectronic component according to claim 1 , wherein the first element has electrical connection points configured to electrically contact the leadframe with a connection carrier.
9. The optoelectronic component according to claim 1 , wherein the second element has at least one electrical contact point on a main side facing the first element, the electrical contact point is configured to electrically contact the semiconductor chip.
10. The optoelectronic component according to claim 1 , wherein the second element projects laterally in places beyond the first element and the third element, and wherein the second element is configured to connect a plurality of leadframes to one another in a composite.
11. A method for producing an optoelectronic component, the method comprising:
providing the leadframe according to claim 1 9 ;
applying an adhesive to the support surface of the third element of the leadframe;
placing the semiconductor chip on the support surface and the adhesive; and
pressing the semiconductor chip against the support surface such that a thin adhesive layer is formed.
12. The method according to claim 11 , wherein the adhesive layer has a thickness of at most 5 micrometers.
13. The method according to claim 11 , wherein the leadframe is coated with a reflective casting compound material by casting, jetting or dispensing in such a way that the reflective casting compound is formed having the planar surface below and laterally of the semiconductor chip.
14. The method according to claim 13 , wherein the gap is formed between the mounting surface of the semiconductor chip and the planar surface of the reflective casting compound.