Device and connection carrier
A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.
1. A device comprising:
a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients;
a semiconductor chip mechanically and electronically connected to the connection carrier; and
a metal layer arranged between the connection carrier and the frame,
wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame,
wherein the metal layer is not in electrically conductive connection,
wherein the metal layer projects beyond the frame in a lateral direction,
wherein the device comprises at least two portions, wherein the portions are separated from each other by frame parts of the frame, and wherein each portion comprises at least one semiconductor chip.
2. The device according to claim 1 , wherein the metal layer is covered by the encapsulation body in some places.
3. The device according to claim 1 , wherein the metal layer has at least two laterally separated regions.
4. The device according to claim 1 , wherein a course of the metal layer in a plane parallel to a main plane of extension of the connection carrier in portions or completely follows a course of the frame in a plane parallel to the main plane of extension of the connection carrier.
5. The device according to claim 1 , wherein the metal layer at its exposed outer surface is covered by an electrically isolating covering layer.
6. The device according to claim 5 , wherein the covering layer in some places covers a base body and contacts of the connection carrier.
7. The device according to claim 1 , wherein the metal layer has a thickness between at least 8 μm and at most 50 μm.
8. The device according to claim 1 , wherein base areas of the at least two portions are different from each other by at least 10%.
9. The device according to claim 1 , wherein each portion is limited in lateral directions by the frame.
10. The device according to claim 1 ,
wherein the metal layer has at least two laterally separated regions,
wherein an adhesive is arranged between the regions, and
wherein the adhesive mechanically connects a base body of the connection carrier with the frame.
11. The device according to claim 10 , wherein the adhesive is directly adjacent to the regions of the metal layer, the base body and the frame.
12. The device according to claim 1 , wherein the metal layer has an opening offset to the semiconductor chip, and wherein opening at least in some parts is filled with an adhesive.
13. A device comprising:
a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients;
a semiconductor chip mechanically and electronically connected to the connection carrier; and
a metal layer arranged between the connection carrier and the frame,
wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame,
wherein the metal layer is not in electrically conductive connection,
the metal layer projects beyond the frame in a lateral direction,
wherein the metal layer has at least two laterally separated regions,
wherein the device comprises at least two portions, wherein the portions are separated from each other by frame parts of the frame, and wherein each portion comprises at least one semiconductor chip.
14. The device according to claim 13 , wherein base areas of the at least two portions are different from each other by at least 10%.
15. The device according to claim 13 , wherein each portion is limited in lateral directions by the frame.
16. A device comprising:
a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients;
a semiconductor chip mechanically and electronically connected to the connection carrier; and
a metal layer arranged between the connection carrier and the frame,
wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame,
wherein the metal layer is not in electrically conductive connection,
wherein the metal layer projects beyond the frame in a lateral direction,
wherein the metal layer has at least two laterally separated regions,
wherein an adhesive is arranged between the regions, and
wherein the adhesive mechanically connects a base body of the connection carrier with the frame.
17. The device according to claim 16 , wherein the adhesive is directly adjacent to the regions of the metal layer, the base body and the frame.
18. The device according to claim 16 , wherein a course of the metal layer in a plane parallel to a main plane of extension of the connection carrier in portions or completely follows a course of the frame in a plane parallel to the main plane of extension of the connection carrier.
19. The device according to claim 16 , wherein the metal layer at its exposed outer surface is covered by an electrically isolating covering layer.
20. The device according to claim 19 , wherein the covering layer in some places covers the base body and contacts of the connection carrier.