Method for producing an optic device, optic device and assembly comprising such an optic device

1. A method for producing an assembly, the method comprising:

providing an optic device which is an LED chip comprising an active medium;

providing a support being a metallic lead frame;

applying an adhesive layer to at least one of the optic device or the support; and

mounting the optic device on the support so that the optic device and the support are permanently and firmly connected,

wherein the adhesive layer comprises at least one organic material and is applied by physical or chemical vapor phase deposition, and

wherein a thickness of the adhesive layer is between 20 nm and 0.6 μm inclusive.

2. The method according to claim 1 ,

wherein the active medium is a semiconductor layer sequence comprising an active zone configured to produce electromagnetic radiation by electroluminescence during operation, and

wherein the LED chip comprises a carrier body which is a substrate to which the semiconductor layer sequence is applied or on which the semiconductor layer sequence is grown.

3. The method according to claim 2 ,

wherein the adhesive layer is solely applied on a side of the substrate facing away from the semiconductor layer sequence, and

wherein the substrate and the adhesive layer are light-transmissive for the electromagnetic radiation.

4. The method according to claim 1 , wherein the adhesive layer comprises at least one of a polyimide, a siloxane, an acrylate or an epoxide.

5. The method according to claim 1 , wherein the adhesive layer comprises a silicone-epoxide hybrid material.

6. The method according to claim 1 , wherein the adhesive layer is applied by at least one of pulsed laser deposition, sputtering, initiated chemical vapor phase deposition or oxidative chemical vapor phase deposition.

7. The method according to claim 1 , wherein the adhesive layer essentially consists of a plurality of organic materials and is grown of a plurality of sub-layers which are stacked one above the other.

8. The method according to claim 7 ,

wherein the adhesive layer comprises a non-adhesive cover layer which is an outmost layer, and

wherein mounting the optic device to the support comprises destroying the cover layer during mounting of the optic device.

9. The method according to claim 1 ,

wherein the support has a mounting face with a roughening,

wherein, during mounting, the adhesive layer is pressed onto the mounting face, and

wherein the roughening penetrates the adhesive layer so that the support comes in direct contact with at least one of a carrier body of the LED hip or the active medium in places.

10. The method according to claim 1 ,

wherein at least one of the support, a carrier body of the LED chip or the active medium comprises electric contact areas,

wherein, during mounting on the support, the adhesive layer remains as a contiguous layer without holes so that the adhesive layer completely covers the electric contact areas, and

wherein the adhesive layer is electrically conductive.

11. The method according to claim 1 ,

wherein at least one of the support, a carrier body of the LED chip and r active medium comprises electric contact areas,

wherein, during mounting on the support, the electric contact areas remain free of the adhesive layer, and

wherein the adhesive layer is electrically insulating.

12. The method according to claim 1 , wherein, during mounting on the support, the adhesive layer is cured by a temperature increase.

13. The method according to claim 1 ,

wherein, during mounting on the support, the adhesive layer is cured by radiation that initiates a photochemical reaction, and

wherein, immediately before mounting, the adhesive layer has a viscosity of at most 100 Pa·s at a temperature of 300 K.

14. The method according to claim 13 , wherein the radiation to cure the adhesive layer is generated by a LED chip.

15. A method for producing an assembly comprising:

providing an optic device comprising an active medium mechanically carried by a carrier body or included in the carrier body;

applying an adhesive layer to at least one of the active medium or the carrier body; and

mounting the optic device that includes the adhesive layer on a support so that the optic device and the support are permanently and firmly connected,

wherein the adhesive layer comprises at least one organic material and is applied by physical or chemical vapor phase deposition,

wherein the support has a mounting face with a roughening,

wherein, during mounting, the adhesive layer is pressed onto the mounting face,

wherein the roughening penetrates the adhesive layer so that the support comes in direct contact with at least one of the carrier body or the active medium in places, and

wherein a thickness of the adhesive layer is between 20 nm and 0.6 μm inclusive.

16. The method according to claim 15 ,

wherein the active medium is a phosphor configured to produce electromagnetic radiation by photoluminescence during operation,

wherein the carrier body, and

wherein the carrier body and the adhesive layer are light-transmissive for the electromagnetic radiation.

17. The method according to claim 16 ,

wherein the carrier body is a matrix material in which the phosphor is embedded, and

wherein the phosphor is in places in direct contact with the adhesive layer.

18. A method for producing an assembly comprising:

providing an optic device comprising an active medium mechanically carried by a carrier body or included in the carrier body;

providing a support being a metallic lead frame;

applying an adhesive layer to at least one of the optic device or the support; and

mounting the optic device on the support so that the optic device and the support are permanently and firmly connected,

wherein the adhesive layer comprises at least one organic material and is applied by physical or chemical vapor phase deposition,

wherein the support has a mounting face with a roughening,

wherein, during mounting, the adhesive layer is pressed onto the mounting face,

wherein the roughening penetrates the adhesive layer so that the support comes in direct contact with at least one of the carrier body or the active medium in places, and

wherein a thickness of the adhesive layer is between 20 nm and 0.6 μm inclusive.