IP Library Granted Patent US 10,444,437
Granted Patent B2
US 10,444,437 · App. 16/114,921 · Granted Oct 15, 2019

Mounting structure for a light guide, housing with a mounting structure, optoelectronic device and method of producing an optoelectronic device

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Quick Facts
Patent No.
US 10,444,437
App. No.
16/114,921
Granted
Oct 15, 2019
Kind
B2
Abstract

A mounting structure for a light guide having a core and a longitudinal axis, wherein the mounting structure includes a holder into which the light guide is insertable obliquely or perpendicular to the longitudinal axis, and the mounting structure is configured to provide an optical coupling to the core of the light guide.

Claims (42)

1. A light-emitting component comprising:

a mounting structure for a light guide having a core and a longitudinal axis, wherein

the mounting structure comprises a holder into which the light guide is insertable obliquely or perpendicular to the longitudinal axis,

the mounting structure is configured to provide an optical coupling to the core of the light guide,

the mounting structure comprises a processing structure configured to locally modify the light guide with respect to its light coupling into the core when inserted into the holder,

the mounting structure comprises a light coupling structure via which light can be coupled into the core of the inserted light guide,

the light coupling structure is reflective or diffusely reflective, and

the light coupling structure is configured such that during operation of the light-emitting component with an inserted light guide, light generated by the light-emitting component initially passes through the light guide essentially perpendicular to the longitudinal axis of the light guide and is coupled into the light guide at the light coupling structure.

2. The light-emitting component according to claim 1 , wherein the processing structure is configured to remove an opaque insulation of the light guide in places when the light guide is inserted into the holder and to fouli a stripped region of the light guide.

3. The light-emitting component according to claim 2 , wherein the processing structure is spaced from the stripped region after the light guide has been completely inserted into the mounting structure.

4. The light-emitting component according to claim 1 , wherein the light coupling structure directly adjoins the core.

5. The light-emitting component according to claim 4 , wherein the light coupling structure is spectrally and/or spatially selective with respect to the incident light.

6. The light-emitting component according to claim 1 , wherein the mounting structure is formed in one piece.

7. The light-emitting component according to claim 1 , wherein the mounting structure is configured to be disposed on a housing of the light-emitting component.

8. A housing of a light-emitting component comprising the light-emitting component according to claim 1 .

9. The housing according to claim 8 , further comprising a housing body and a lead frame, wherein the lead frame is configured for external electrical contacting of the light-emitting component, and the mounting structure is formed as a part of the lead frame.

10. An optoelectronic device with at least two light-emitting components, a detector and a light guide having a core and a longitudinal axis, wherein

the light-emitting components are each assigned the light-emitting component according to claim 1 ,

the light guide is inserted into the mounting structures so that during operation of the optoelectronic device a part of at most 10% of the light generated by the light-emitting components is coupled into the light guide in each case, and

light emerging from the light guide at least partially impinges on the detector.

11. The optoelectronic device according to claim 10 , wherein, in the region of each mounting structure, the optoelectronic device comprises a medium that modifies a light coupling into the light guide.

12. The optoelectronic device according to claim 10 , wherein the mounting structures each have a deflection device that covers the associated light-emitting component in places in plan view of the optoelectronic device.

13. A light-emitting component comprising:

a housing with a lead frame, and

a mounting structure for a light guide having a core and a longitudinal axis, wherein

the mounting structure comprises a holder into which the light guide is insertable obliquely or perpendicular to the longitudinal axis,

the mounting structure is configured to provide an optical coupling to the core of the light guide,

the lead frame is configured for external electrical contacting of the light-emitting component, and

the mounting structure is formed as a part of the lead frame.

14. A method of producing an optoelectronic device comprising:

a) providing at least two light-emitting components, each of which comprise

a housing with a lead frame, and

a mounting structure for a light guide having a core and a longitudinal axis, wherein

the mounting structure comprises a holder into which the light guide is insertable obliquely or perpendicular to the longitudinal axis,

the mounting structure is configured to provide an optical coupling to the core of the light guide,

the lead frame is configured for external electrical contacting, of the light-emitting component, and

the mounting structure is formed as a part of the lead frame;

b) inserting the light guide into the holders of the mounting structures; and

c) establishing an optical coupling to the core of the light guide in the region of the mounting structures.

15. The method according to claim 14 , wherein the optical coupling takes place when the light guide is inserted into the holders.

16. The method according to claim 14 , wherein the light-emitting components and the associated mounting structures are fastened on a connection carrier in a common manufacturing step.

17. The method according to claim 16 , wherein the mounting structures and the associated light-emitting components are each fastened to spaced-apart connection areas of the connection carrier by a soldering process.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2018
From: LORENZ, STEFAN; BAUR, ELMAR
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 047092/0633 →