Method of embedding opto-electronic components in a layer
A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.
1. A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, comprising:
providing a molding tool having a bearing plate, wherein the bearing plate on a lower side comprises resilient bearing regions,
bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components,
filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and
removing the molding tool from the layer and the embedded components,
wherein the molding tool comprises a compression plate, the compression plate on a lower side comprises bearing elements, the bearing elements are mutually spaced apart, the compression plate by way of the bearing elements bears on an upper side of the bearing plate, and when filling the molding material into the intermediate space the compression plate by way of the bearing elements presses the bearing plate against the components,
the bearing elements have the form of pins lead out of a lower side of the compression plate,
the bearing elements are disposed on an upper side of the bearing plate, and
the bearing elements are disposed laterally of the components in the regions between the components.
2. The method according to claim 1 , wherein the bearing plate is formed from a resilient material, the lower side of the bearing plate represents the resilient bearing regions, and the bearing elements of the compression plate are disposed to be at least in part laterally offset in relation to the components.
3. The method according to claim 1 , wherein the bearing plate on the lower side comprises bearing blocks, the bearing blocks are disposed in the same grid as the components, the bearing blocks comprise bearing faces, and a bearing face of a bearing block is each disposed above an upper side of a component.
4. The method according to claim 3 , wherein the bearing blocks are resiliently connected to the bearing plate.
5. The method according to claim 4 , wherein the bearing blocks are connected to the bearing plate by way of spring elements.
6. The method according to claim 1 , wherein a film is disposed between the molding tool and the components, the film bears on the upper side of the components, the film is disposed between the intermediate space and the molding tool, and the film protects the molding tool from wetting by molding material.
7. The method of claim 1 , wherein a pressure in a direction toward the bearing plate is exerted on the compression plate by the bearing elements, the bearing elements press the bearing plate against upper sides of the components, and by the configuration of the bearing plate from a resilient material, the lower side of the bearing plate between the components flexes in a direction toward an intermediate space between the components.
8. The method of claim 7 , wherein flexing of the bearing plate in the direction toward the intermediate space between the components can correspond to 1% to 5% or more of the thickness of the bearing plate.