Sensor element

1. A sensor element comprising:

a substrate;

a light emitting semiconductor chip arranged with a mounting face on a mounting face of the substrate,

wherein the semiconductor chip has a smaller mounting face than the substrate,

wherein a border area of the mounting face of the substrate circumvents the semiconductor chip,

wherein on a bottom side of the semiconductor chip electrical contacts are arranged, and

wherein the substrate is transparent for radiation of the semiconductor chip,

a carrier,

wherein the bottom side of the semiconductor chip is arranged on a mounting face of the carrier,

wherein the carrier comprises further electrical contacts on the mounting face, and

wherein the contacts of the semiconductor chip and the further contacts of the carrier are connected;

a sealing member arranged between the mounting face of the carrier and the border area of the substrate,

wherein the sealing member seals a sealing area between the substrate and the carrier,

wherein the semiconductor chip is arranged in the sealing area,

wherein a recess is arranged in the mounting face of the carrier, and

wherein the recess is arranged beside the semiconductor chip and within the sealing area; and

an optical sensor arranged in the recess.

2. The sensor element of claim 1 , wherein a height of the optical sensor is smaller than a depth of the recess of the carrier.

3. The sensor element of claim 1 , further comprising an electronic circuit arranged in a further recess of the carrier, wherein the optical sensor is electrically connected with the electronic circuit.

4. The sensor element of claim 1 , wherein the carrier is not transparent and is configured to absorb the radiation of the semiconductor chip.

5. The sensor element of claim 1 , wherein a recess is arranged in the mounting face of the substrate within the sealing area and beside the semiconductor chip, and wherein the recess of the substrate is arranged at least partially between the semiconductor chip and the recess of the carrier.

6. The sensor element of claim 5 , wherein the recess of the substrate is at least partially arranged above the recess of the carrier.

7. The sensor element of claim 1 , wherein the substrate is made of sapphire and/or the carrier is made of ceramic.

8. The sensor element of claim 1 , wherein the optical sensor is configured to sense ultraviolet light.

9. The sensor element of claim 1 , wherein the semiconductor chip is a light emitting diode.

10. The sensor element of claim 1 , wherein the sealing member comprises a ring, wherein the ring surrounds the semiconductor chip and the recess of the carrier, and wherein the ring is connected with the substrate and with the carrier.

11. The sensor element of claim 10 , wherein the ring comprises a first metal layer that is arranged on the substrate and a second metal layer that is arranged on the carrier, and wherein the first and second metal layers are connected.

12. The sensor element of claim 1 , wherein the substrate comprises a protective layer comprising a self-cleaning coating.

13. The sensor element of claim 12 , wherein the self-cleaning coating is configured to be activated by the radiation of the semiconductor chip.

14. The sensor element of claim 1 , wherein the carrier comprises an electronic circuit configured to evaluate a measurement of the optical sensor.

15. A sensor element comprising:

a substrate;

a light emitting semiconductor chip arranged with a mounting face on a mounting face of the substrate,

wherein the semiconductor chip has a smaller mounting face than the substrate,

wherein a border area of the mounting face of the substrate circumvents the semiconductor chip,

wherein on a bottom side of the semiconductor chip electrical contacts are arranged, and

wherein the substrate is transparent for radiation of the semiconductor chip;

a carrier,

wherein the bottom side of the semiconductor chip is arranged on a mounting face of the carrier,

wherein the carrier comprises further electrical contacts on the mounting face,

wherein the contacts of the semiconductor chip and the further contacts of the carrier are connected, and

wherein a recess is arranged in the mounting face of the carrier;

a sealing member arranged between the mounting face of the carrier and the border area of the substrate,

wherein the sealing member seals a sealing area between the substrate and the carrier,

wherein the semiconductor chip is arranged in the sealing area, and

wherein the recess is arranged beside the semiconductor chip and within the sealing area;

an optical sensor arranged in the recess,

wherein a height of the optical sensor is smaller than a depth of the recess of the carrier; and

an electronic circuit arranged in a further recess of the carrier,

wherein the optical sensor is electrically connected with the electronic circuit,

wherein the carrier is not transparent and is configured to absorb the radiation of the semiconductor chip,

wherein the optical sensor is configured to sense ultraviolet light, and

wherein the semiconductor chip is a light emitting diode.

16. The sensor element of claim 15 , further comprising a ring, wherein the ring comprises a first metal layer that is arranged on the substrate and a second metal layer that is arranged on the carrier, and wherein the first and second metal layers are connected.

17. A sensor element comprising:

a substrate;

a light emitting semiconductor chip,

wherein the semiconductor chip is arranged with a mounting face on a mounting face of the substrate,

wherein the semiconductor chip has a smaller mounting face than the substrate,

wherein a border area of the mounting face of the substrate circumvents the semiconductor chip,

wherein on a bottom side of the semiconductor chip electrical contacts are arranged,

wherein the substrate is transparent for radiation of the semiconductor chip;

a carrier,

wherein the bottom side of the semiconductor chip is arranged on a mounting face of the carrier,

wherein the carrier comprises further electrical contacts on the mounting face, and

wherein the contacts of the semiconductor chip and the further contacts of the carrier are connected;

a sealing member arranged between the mounting face of the carrier and the border area of the substrate,

wherein the sealing member seals a sealing area between the substrate and the carrier,

wherein the semiconductor chip is arranged in the sealing area,

wherein a recess is arranged in the mounting face of the carrier, and

wherein the recess of the carrier is arranged beside the semiconductor chip and within the sealing area; and

an optical sensor arranged in the recess,

wherein the optical sensor is configured to sense ultraviolet light,

wherein the semiconductor chip is a light emitting diode,

wherein the sealing member comprises a ring,

wherein the ring surrounds the semiconductor chip and the recess of the carrier, and

wherein the ring is connected with the substrate and with the carrier.

18. The sensor element of claim 17 , wherein the ring comprises a first metal layer that is arranged on the substrate and a second metal layer that is arranged on the carrier, and wherein the first and second metal layers are connected.