Method for lateral patterning of a pattern layer with three-dimensional pattern elements, and semiconductor device
The invention relates to a method for laterally structuring a structured layer ( 2 ) with a plurality of three-dimensional structure elements ( 20 ), having the following steps: a) providing the structured layer with the three-dimensional structure elements; b) forming a laterally structured covering layer ( 3 ) on the structured layer in order to define at least one structured layer region ( 4 ) to be removed; and c) removing the structured layer region to be removed by means of a force acting on the structure elements in the region to be removed. The invention further relates to a semiconductor component ( 1 ).
1. A method for producing a semiconductor device comprising a pattern layer with a plurality of three-dimensional pattern elements, having the steps:
a) provision of the pattern layer with the three-dimensional pattern elements;
b) formation of a laterally patterned covering layer on the pattern layer to determine at least one region to be removed of the pattern layer; and
c) removal of the region to be removed of the pattern layer by means of a force acting on the pattern elements in the region to be removed, so that the pattern elements in the region to be removed break and the pattern layer in a top view is subdivided in a device region and a stripped region,
wherein the pattern layer is provided on a substrate in step a),
wherein in step c), the region to be removed of the pattern layer is removed from the substrate, and
wherein the semiconductor device comprises the device region of the pattern layer on the substrate.
2. The method according to claim 1 , wherein the three-dimensional pattern elements have a maximum extent in at least one lateral direction of at most 5 μm.
3. The method according to claim 2 , wherein the extent of the pattern elements in a direction perpendicular to the lateral direction is at least twice as great as the maximum extent in the lateral direction.
4. The method according to claim 1 , wherein in step b) the region to be removed is free of the covering layer.
5. The method according to claim 4 , wherein the applied force is exerted by a medium introduced with overpressure or by mechanical wiping.
6. The method according to claim 4 , wherein the applied force is exerted by ultrasound or vibration.
7. The method according to claim 1 , wherein in step b) the region to be removed is covered by the covering layer.
8. The method according to claim 7 , wherein the covering layer is peeled off together with the pattern elements in the region to be removed.
9. The method according to claim 7 , wherein the applied force is exerted by a thermally induced change in extent of the covering layer.