Radiation Body and Method for Producing a Radiation Body

1 - 17 . (canceled)

18 . A radiation body comprising:

a basic body configured to generate or absorb electromagnetic radiation;

at least one main side having a rough structure of first elevations; and

at least one structured radiation surface structured with a fine structure of second elevations,

wherein the radiation is decoupled from the radiation body or coupled into the radiation body via the structured radiation surface such that the radiation passes the fine structure and the fine structure brings about a gradual refractive index change for the radiation between materials adjoining the structured radiation surface,

wherein the radiation has a global maximum of radiation intensity at a main wavelength λ max measured in vacuum,

wherein the first elevations comprise heights and widths in each case of at least λ max /n,

wherein n is the refractive index of a material from which the radiation impinges on the structured radiation surface,

wherein each second elevation tapers toward a maximum of the respective second elevation and each second elevations has a height of at least 0.6·λ max /n and a width of λ max /(2n) at most in each case, and

wherein a distance between neighboring second elevations is λ max /(2n) at most.

19 . The radiation body according to claim 18 ,

wherein the radiation body is an optoelectronic semiconductor body in form of an electro-luminescent light-emitting diode,

wherein the basic body is a semiconductor layer sequence having an active layer configured to generate electromagnetic radiation,

wherein the fine structure is made from a material of the basic body,

wherein the first elevations have heights and widths of 5 μm at the most, and

wherein the active layer is based on GaAs, AlGaAs or InAlGaAsP and configured to generate radiation in an infrared wavelength range with a main wavelength λ max of at least 950 nm measured in vacuum.

20 . The radiation body according to claim 18 ,

wherein the fine structure is made from the material of the basic body,

wherein the radiation body is configured to receive electromagnetic radiation in a visible spectral range or an infrared spectral range, and

wherein the second elevations of the fine structure have heights of at least 1.5·λ max /n.

21 . The radiation body according to claim 18 ,

wherein the rough structure and/or the fine structure is/are made from a material different from a material of the basic body, and

wherein refractive indices of the adjoining materials of the basic body and the rough structure and/or the fine structure deviate from one another by 0.2 at the most.

22 . The radiation body according to claim 18 ,

wherein the fine structure is arranged on the rough structure and the second elevations at least partially rise from side surfaces of the first elevations, and

wherein the first elevations widen at least in sections in the direction away from an active layer so that peaks of the second elevations point in the direction of the main side in these widening sections.

23 . The radiation body according to claim 18 ,

wherein the main side with the rough structure is formed on a side of the radiation body opposite the structured radiation surface.

24 . The radiation body according to claim 18 ,

wherein first elevations arranged next to one another have alternating heights and/or widths with deviations in the heights and/or widths of at least 30%.

25 . The radiation body according to claim 18 ,

wherein a radiation-transmissive layer or a converter layer for shifting the wavelength of the impinging or decoupled radiation is applied on to the structured radiation surface, and

wherein the radiation-transmissive layer or the converter layer completely encloses and encapsulates the first and/or second elevations.

26 . The radiation body according to claim 18 ,

wherein the basic body is based on GaN; and

wherein the rough structure and the fine structure are based on titanium oxide.

27 . A method for producing a radiation body, the method comprising:

providing a base body, wherein, when operated as intended, radiation generated in the base body or impinging on the radiation body has a global maximum of s radiation intensity at a main wavelength λ max measured in vacuum;

applying a rough structure of first elevations to a main side of the base body; and

forming a structured radiation surface with a fine structure of second elevations, wherein the radiation is decoupled from the radiation body or coupled into the radiation body via the structured radiation surface,

wherein the first elevations comprise heights and widths in each case of at least λ max /n,

wherein n is a refractive index of a material from which the radiation impinges on the structured radiation surface,

wherein the second elevations comprise heights of at least 0.6·λ max /n and widths of λ max /(2n) at most,

wherein a distance between neighboring second elevations is λ max /(2n) at most, and

wherein the rough structure and/or the fine structure are applied to the base body as a separate layer.

28 . The method according to claim 27 ,

wherein the base body is a semiconductor layer sequence having an active layer which generates or absorbs electromagnetic radiation when operated as intended, and

wherein the rough structure and/or the fine structure is/are formed into the base body by wet-chemical etching or a dry-chemical etching.

29 . The method according to claim 27 ,

wherein the separate layer comprises a material different from that of the base body, and

wherein the separate layer is structured prior to or after application on to the base body.

30 . The method according to claim 27 , wherein forming the structured radiation surface comprises:

periodically applying auxiliary structures to the surface to be structured, wherein the auxiliary structures comprise widths parallel to the surface of λ max /(2n) at most; and

subsequently performing a directed or undirected etching, wherein etching etches sections of the surface to be structured between the auxiliary structures more than sections below the auxiliary structures thereby forming the second elevations.

31 . The method according to claim 27 , wherein forming the structured radiation surface comprises performing etching, in which nonvolatile residues remain on the surface to be structured due to an occurrence of an chemical reaction during etching, wherein the nonvolatile residues form auxiliary structures.

32 . The method according to claim 27 , wherein forming the structured radiation surface structured comprises:

placing seeds on the surface to be structured during or after growth of the base body; and

subsequently continuing the growth of the base body, wherein the second elevations are formed from the material of the base body in section of the seeds.

33 . The method according to claim 27 ,

wherein a stepper method is used for forming the structured radiation surface structured with the fine structure.

34 . The method according to claim 27 , wherein forming the structured radiation surface comprises applying self-aligning nanostructures to the surface to be structured, wherein the refractive index of a material of the nanostructures deviates from the refractive index of the surface to be structured by less than 0.2.

35 . A radiation body comprising:

a basic body configured to generate or absorb electromagnetic radiation;

at least one main side provided with a rough structure of first elevations; and

at least one radiation structured surface structured with a fine structure of second elevations,

wherein the radiation is decoupled from the radiation body or coupled into the radiation body via the structured radiation surface such that the radiation passes the fine structure and the fine structure brings about a gradual refractive index change for the radiation between materials adjoining the structured radiation surface,

wherein the radiation has a global maximum of a radiation intensity at a main wavelength λ max measured in vacuum,

wherein the first elevations comprise heights and widths in each case of at least λ max /n,

wherein n is the refractive index of the material from which the radiation impinges on the structured radiation surface,

wherein each second elevation tapers toward a maximum of the respective second elevation and each has a height of at least 0.6·λ max /n and a width of λ max /(2n) at most,

wherein a distance between neighboring second elevations is λ max /(2n) at most, and

wherein the rough structure and/or the fine structure is applied to the basic body as a separate layer.

36 . The radiation body according to claim 35 , wherein the separate layer is a layer of silicone, a resin, a silicon oxide or a titanium oxide.