Light-emitting diode chip, and method for manufacturing a light-emitting diode chip

1. A light-emitting diode chip comprising:

an epitaxial semiconductor layer sequence having an active zone configured to generate electromagnetic radiation during operation; and

a passivation layer comprising statically fixed electrical charge carriers,

wherein the passivation layer is located on a side surface of the semiconductor layer sequence covering at least the active zone,

wherein the semiconductor layer sequence is based on a phosphide compound semiconductor material,

wherein the passivation layer is arranged directly on the semiconductor layer sequence,

wherein the passivation layer comprises an aluminum phosphide layer and an aluminum oxide layer, and

wherein the passivation layer comprises at least 95% aluminum oxide.

2. The light-emitting diode chip according to claim 1 , wherein the statically fixed charge carriers are electrons.

3. The light-emitting diode chip according to claim 1 , wherein the statically fixed charge carriers of the passivation layer form a bending of a conduction band edge and a valence band edge in a semiconductor material of the epitaxial semiconductor layer sequence adjoining the passivation layer, so that charge carriers, whose charge is opposite to the charge of the statically fixed charge carriers, accumulate in the semiconductor material.

4. The light-emitting diode chip according to claim 1 , wherein the epitaxial semiconductor layer sequence is based on a III/V semiconductor composite material.

5. The light-emitting diode chip according to claim 1 , wherein the passivation layer has a thickness of between 1 nanometer and 100 nanometers inclusive.

6. The light-emitting diode chip according to claim 1 , wherein the light-emitting diode chip has an edge length that does not exceed 1 millimeter.

7. The light-emitting diode chip according to claim 1 , wherein the passivation layer comprises one of the following materials: aluminum oxide, silicon oxide, aluminum phosphide, or indium aluminum phosphide.

8. A method for producing a light-emitting diode chip, the method comprising:

providing an epitaxially grown semiconductor layer sequence having an active zone, the active zone being suitable for producing electromagnetic radiation; and

applying a passivation layer to a side surface of the semiconductor layer sequence so that electrical charge carriers are statically fixed in the passivation layer, wherein the passivation layer comprises at least 95% aluminum oxide

wherein applying the passivation layer comprises:

applying a non-stoichiometric silicon oxide layer directly on the side surface of the semiconductor layer sequence;

applying an aluminum oxide layer directly on the silicon oxide layer forming a layer composite; and

tempering the layer composite so that an aluminum oxide-containing layer is formed at an interface between the passivation layer and the semiconductor layer sequence.

9. The method according to claim 8 , further comprising producing the side surface of the semiconductor layer sequence by etching.

10. The method according to claim 8 , wherein the silicon oxide layer is deposited by thermal evaporation and the aluminum oxide layer is deposited by an ALD method.