Light-emitting semiconductor chip, light-emitting component and method for producing a light-emitting component

1. A light-emitting semiconductor chip comprising:

a light-transmissive substrate having a top surface, a bottom surface opposite the top surface, a first side surface extending transversely or perpendicularly to the bottom surface, and a second side surface arranged opposite the first side surface;

a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light; and

a contacting comprising a first current distribution structure and a second current distribution structure, the contacting configured to supply current to the active region,

wherein the first current distribution structure and the second current distribution structure are freely accessible from a side of the semiconductor body facing away from the substrate,

wherein the semiconductor chip, on the side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, is free of any connection point configured to electrically contact the first and second current distribution structures,

wherein the first current distribution structure has a smaller distance to the first side surface than the second current distribution structure, and

wherein the second current distribution structure has a smaller distance from the second side surface than the first current distribution structure.

2. The light-emitting semiconductor chip according to claim 1 , wherein the semiconductor chip is free of any connection point configured to electrically contact the first and second current distribution structures.

3. The light-emitting semiconductor chip according to claim 1 , wherein the first current distribution structure has an end region on the first side surface, in which the first current distribution structure extends transversely or perpendicularly to a longitudinal axis of the top surface of the semiconductor body facing away from the substrate, and/or wherein the second current distribution structure has an end region on the second side surface, in which the second current distribution structure extends transversely or perpendicularly to the longitudinal axis.

4. The light-emitting semiconductor chip according to claim 1 , wherein the first current distribution structure extends to a first end face of the semiconductor chip and terminates at the first end face flush with the first side surface of the substrate and/or the first side surface of the semiconductor body.

5. The light-emitting semiconductor chip according to claim 4 , wherein the second current distribution structure extends to a second end face of the semiconductor chip and terminates at the second end face flush with the second side surface of the substrate and/or the second side surface of the semiconductor body.

6. The light-emitting semiconductor chip according to claim 5 , wherein the first end face and the second end face are arranged opposite one another.

7. A light-emitting component comprising:

a light-emitting semiconductor chip comprising a first end face and a second end face opposite the first end face;

a light-transmissive casing;

a first connection element for electrically contacting the light-emitting semiconductor chip; and

a second connection element for electrically contacting the light-emitting semiconductor chip,

wherein the casing surrounds the light-emitting semiconductor chip in places,

wherein the light-emitting semiconductor chip protrudes from the casing at the first end face,

wherein the light-emitting semiconductor chip protrudes from the casing at the second end face, and

wherein the first connection element and the second connection element contact the light-emitting semiconductor chip in a region of one of the end faces respectively.

8. The light-emitting component according to claim 7 , wherein the first connection element completely covers the first end face, and wherein the second connection element completely covers the second end face.

9. The light-emitting component according to claim 7 , wherein the first connection element covers the first end face and the second end face, and wherein the second connection element covers the first end face and the second end face.

10. The light-emitting component according to claim 7 , wherein the first connection element and the second connection element are in direct contact with the light-emitting semiconductor chip and the casing.

11. The light-emitting component according to claim 7 , wherein the light-emitting component comprises two or more light-emitting semiconductor chips being electrically conductively connected to one another.

12. The light-emitting component according to claim 7 , wherein the light-emitting component comprises two or more light-emitting semiconductor chips, which are electrically conductively connected to one another, and wherein mutually adjacent semiconductor chips are electrically conductively connected to one another by the first connection element and/or the second connection element.

13. The light-emitting component according to claim 7 , wherein the first end face comprises a first side surface of a substrate, wherein the second end face comprises a second side surface of the substrate, and wherein each current distribution structure is in direct contact with precisely one of the connection elements.

14. The light-emitting component according to claim 7 , wherein the casing completely covers a first current distribution structure in the region of each of the end faces and a second current distribution structures projects from the casing and is free of the casing in places.

15. The light-emitting component according to claim 7 , further comprising a light guide, wherein the light-emitting semiconductor chip is arranged on an end face of the light guide, and wherein the first connection element and/or the second connection element covers an outer surface of the light guide in places.

16. A method for producing a light-emitting component, the method comprising:

providing a mold having an opening, a first recess in the opening and a second recess in the opening;

providing a light-emitting semiconductor chip comprising a first end face and a second end face opposite the first end face;

inserting the light-emitting semiconductor chip into the opening of the mold such that the first end face is arranged in the first recess and the second end face is arranged in the second recess;

introducing a light-transmissive casing into the opening such that the casing surrounds the light-emitting semiconductor chip except for regions of the light-emitting semiconductor chip, which are arranged in the first recess and in the second recess;

removing the mold; and

applying a first connection element and a second connection element for electrically contacting the light-emitting semiconductor chip in regions of the light-emitting semiconductor chip not covered by the casing.

17. The method according to claim 16 , wherein two or more light-emitting semiconductor chips are provided, and wherein the mold has a first recess and a second recess for each of the semiconductor chips.

18. The method according to claim 16 , wherein the first end face comprises a first side surface of a substrate, wherein the second end face comprises a second side surface of the substrate, and wherein each current distribution structure is brought into direct contact with precisely one of the connection elements.

19. The method according to claim 16 , wherein the light-emitting component comprises the light-emitting semiconductor chip comprising a first end face and a second end face opposite the first end face, the light-transmissive casing, the first connection element for electrically contacting the light-emitting semiconductor chip and the second connection element for electrically contacting the light-emitting semiconductor chip, wherein the casing surrounds the light-emitting semiconductor chip in places, wherein the light-emitting semiconductor chip protrudes from the casing at the first end face, wherein the light-emitting semiconductor chip protrudes from the casing at the second end face, and wherein the first connection element and the second connection element contact the light-emitting semiconductor chip in a region of one of the end faces respectively.