Method for producing an optoelectronic semiconductor device and optoelectronic semiconductor device

1. A method for producing an optoelectronic semiconductor device, the method comprising:

providing a semiconductor layer sequence comprising a light-emitting and/or light-absorbing active zone and a top face downstream of the active zone in a stack direction extending perpendicular to a main plane of extension of the semiconductor layer sequence;

applying a layer stack onto the top face, wherein the layer stack comprises a first interlayer formed with indium gallium oxide, an oxide layer containing indium, and an intermediate face downstream of the top face in the stack direction; and

applying a contact layer onto the intermediate face, wherein the contact layer comprises indium tin oxide, wherein the layer stack is, within the bounds of manufacturing tolerances, free of tin,

wherein applying the first interlayer comprises epitaxially depositing a nitride interlayer, formed with indium gallium nitride, and at least partially oxidizing the nitride interlayer to form the first interlayer.

2. The method according to claim 1 , wherein applying the oxide layer comprises providing a nitride layer containing indium, and at least partially oxidizing the nitride layer to form the oxide layer.

3. The method according to claim 2 , wherein oxidizing is performed after applying the contact layer.

4. The method according to claim 2 , wherein the nitride layer is epitaxially deposited under three-dimensional growth conditions such that the nitride layer has a plurality of multilayer islands which are not joined together.

5. The method according to claim 1 , wherein oxidizing is performed in a reaction chamber and, while oxidizing, a reaction temperature in the reaction chamber amounts to at least 460° C. and at most 720° C.

6. The method according to claim 1 , wherein applying the oxide layer comprises epitaxial depositing indium oxide.

7. The method according to claim 6 , wherein epitaxial depositing comprises epitaxial depositing under two-dimensional growth conditions such that the oxide layer is contiguous.

8. The method according to claim 1 , wherein the contact layer is applied onto the intermediate face under growth conditions in which, in case of direct application onto the top face, a crystal orientation of a crystal structure of the contact layer is obtained, and wherein the crystal structure of the contact layer has a crystal orientation.

9. A optoelectronic semiconductor device comprising:

a semiconductor layer sequence including a light-emitting and/or light-absorbing active zone and a top face downstream of the active zone in a stack direction extending perpendicular to a main plane of extension of the semiconductor layer sequence;

a layer stack arranged at the top face, the layer stack including an oxide layer containing indium, and an intermediate face downstream of the top face in the stack direction; and

a contact layer arranged at the intermediate face, the contact layer comprising indium tin oxide,

wherein the layer stack is, within the bounds of manufacturing tolerances, free of tin, and

wherein a first boundary region between the semiconductor layer sequence and the layer stack and/or a second boundary region between the layer stack and the contact layer have a lower density of defects than an alternative boundary region between a semiconductor layer sequence and a contact layer of an alternative semiconductor device, in which the contact layer is applied directly onto the semiconductor layer sequence.

10. The optoelectronic semiconductor device according to claim 9 , wherein the oxide layer is, within the bounds of manufacturing tolerances, free of gallium.

11. The optoelectronic semiconductor device according to claim 9 , wherein the layer stack further includes a first interlayer comprising indium gallium oxide, and wherein the first interlayer is arranged between the semiconductor layer sequence and the oxide layer and directly adjoins the oxide layer.

12. The optoelectronic semiconductor device according to claim 11 , wherein the layer stack further includes a second interlayer comprising indium gallium nitride, wherein the second interlayer is arranged between the semiconductor layer sequence and the first interlayer and directly adjoins the top face, and wherein the second interlayer is, within the bounds of manufacturing tolerances, free of oxygen.

13. The optoelectronic semiconductor device according to claim 9 , wherein the layer stack includes indium nitride.

14. The optoelectronic semiconductor device according to claim 9 , wherein a crystal structure of the contact layer has a crystal orientation.

15. The optoelectronic semiconductor device according to claim 9 , wherein the oxide layer has a plurality of multilayer islands which are not joined together.

16. The optoelectronic semiconductor device according to claim 15 , wherein an average height of the islands along the stack direction amounts to at least 50 and at most 200 monolayers.

17. The optoelectronic semiconductor device according to claim 9 , wherein the oxide layer is contiguous.

18. The optoelectronic semiconductor device according to claim 9 , wherein an average thickness of the oxide layer along the stack direction amounts to at least 0.5 and at most 3 monolayers.

19. A optoelectronic semiconductor device comprising:

a semiconductor layer sequence including a light-emitting and/or light-absorbing active zone and a top face downstream of the active zone in a stack direction extending perpendicular to a main plane of extension of the semiconductor layer sequence;

a layer stack arranged at the top face, the layer stack including an oxide layer containing indium, and an intermediate face downstream of the top face in the stack direction; and

a contact layer arranged at the intermediate face, the contact layer comprising indium tin oxide,

wherein the layer stack is, within the bounds of manufacturing tolerances, free of tin, and

wherein the oxide layer has a plurality of multilayer islands which are not joined together.