Patent Assignment
Reel/Frame 048598/0293
Assignment of Assignor's Interest
Recorded: 2019-03-14
Pages: 4
Assignors
KIM, KI-SEOK
Executed: 2019-02-26
JUNG, HYUNG-MI
Executed: 2019-02-26
SHIM, JI-HYE
Executed: 2019-02-26
LEE, HWA-YOUNG
Executed: 2019-02-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Resin Composition for Printed Circuit Board and Integrated Circuit Package, and Product Using the Same
Application:
16/353,184 →
Publication:
US 2019/0345323
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.