Patent Assignment
Reel/Frame 048599/0369
Assignment of Assignor's Interest
Recorded: 2019-03-14
Pages: 4
Assignor
HIROCHI, YUKITOMO
Executed: 2018-12-25
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium