Patent Assignment
Reel/Frame 048614/0536
Assignment of Assignor's Interest
Recorded: 2019-03-15
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device Structure