Patent Assignment
Reel/Frame 048634/0919
Assignment of Assignor's Interest
Recorded: 2019-03-19
Pages: 7
Assignors
LEE, MIN-JAE
Executed: 2019-02-07
KIM, SANG-LOK
Executed: 2019-02-07
JEONG, BYUNG-HOON
Executed: 2019-02-07
LEE, TAE-SUNG
Executed: 2019-02-07
IHM, JEONG-DON
Executed: 2019-02-07
JEONG, JAE-YONG
Executed: 2019-02-07
CHOI, YOUNG-DON
Executed: 2019-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Defect Detection Structure of a Semiconductor Die, Semiconductor Device Including the Same and Method of Detecting Defects in Semiconductor Die