Patent Assignment
Reel/Frame 048639/0444
Assignment of Assignor's Interest
Recorded: 2019-03-19
Pages: 6
Assignors
LEE, DONG-KAK
Executed: 2019-01-03
SON, YOON-HO
Executed: 2019-01-03
LEE, MONG-SUP
Executed: 2019-03-07
YI, WOOK-YEOL
Executed: 2019-01-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including a Boron-Containing Insulating Pattern