Patent Assignment
Reel/Frame 048647/0837
Assignment of Assignor's Interest
Recorded: 2019-03-20
Pages: 7
Assignors
KIM, KYOUNG-SOO
Executed: 2018-11-26
BAEK, SEUNG-DUK
Executed: 2018-11-26
KANG, SUN-WON
Executed: 2018-11-26
SONG, HO-GEON
Executed: 2018-11-26
CHANG, GUN-HO
Executed: 2018-11-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including the Same