Patent Assignment
Reel/Frame 048668/0442
Assignment of Assignor's Interest
Recorded: 2019-03-22
Pages: 5
Assignor
CHOI, KEUN-HO
Executed: 2019-01-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Wire, Semiconductor Package Including the Same, and Wire Bonding Method