Patent Assignment
Reel/Frame 048670/0154
Assignment of Assignor's Interest
Recorded: 2019-03-22
Pages: 7
Assignors
MOON, SUN-MIN
Executed: 2019-02-13
KIM, SU-HWAN
Executed: 2019-02-13
KIM, HYUN-JUN
Executed: 2019-02-13
PARK, SEONG-YUL
Executed: 2019-02-13
PARK, YOUNG-LIM
Executed: 2019-02-13
CHANG, JAE-WAN
Executed: 2019-02-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Fabricating the Same