Patent Assignment
Reel/Frame 048671/0135
Assignment of Assignor's Interest
Recorded: 2019-03-22
Pages: 7
Assignors
OH, JUN-YOUNG
Executed: 2018-12-11
KIM, HYUN-KI
Executed: 2018-12-11
KIM, SANG-SOO
Executed: 2018-12-11
KIM, SEUNG-HWAN
Executed: 2018-12-11
LEE, YONG-KWAN
Executed: 2018-12-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same