Patent Assignment
Reel/Frame 048674/0617
Assignment of Assignor's Interest
Recorded: 2019-03-22
Pages: 5
Assignors
KIM, IL HWAN
Executed: 2019-02-13
KANG, UN BYOUNG
Executed: 2019-02-13
LEE, CHUNG SUN
Executed: 2019-02-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Package Having Redistribution Layer