Patent Assignment
Reel/Frame 048689/0478
Assignment of Assignor's Interest
Recorded: 2019-03-25
Pages: 8
Assignors
HARADA, KATSUYOSHI
Executed: 2019-02-25
TAKASAWA, YUSHIN
Executed: 2019-02-25
SHIMAMOTO, SATOSHI
Executed: 2019-02-25
SONE, SHIN
Executed: 2019-03-03
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium