Patent Assignment
Reel/Frame 048703/0502
Assignment of Assignor's Interest
Recorded: 2019-03-26
Pages: 3
Assignor
YAMAMOTO, RYOHEI
Executed: 2019-03-15
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Producing a Wafer from an Ingot Including a Peel-Off Detecting Step