Patent Assignment
Reel/Frame 048708/0956
Assignment of Assignor's Interest
Recorded: 2019-03-27
Pages: 5
Assignors
YAU, WAN YIN
Executed: 2019-03-07
CHAN, SEE LOK
Executed: 2019-03-07
CHENG, CHI WAH
Executed: 2019-03-07
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Die Bonder Incorporating Rotatable Adhesive Dispenser Head
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.