Patent Assignment
Reel/Frame 048712/0646
Assignment of Assignor's Interest
Recorded: 2019-03-27
Pages: 8
Assignors
HUANG, RU-YING
Executed: 2019-02-25
CHEN, YUNG-CHING
Executed: 2019-03-19
LIN, YUEH-CHIOU
Executed: 2019-02-22
KUO, YIAN-LIANG
Executed: 2019-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pad Structure for Enhanced Bondability