Patent Assignment
Reel/Frame 048727/0094
Assignment of Assignor's Interest
Recorded: 2019-03-28
Pages: 11
Assignors
HUANG, SIN-YAO
Executed: 2015-07-15
CHUANG, CHUN-CHIEH
Executed: 2015-07-17
WANG, CHING-CHUN
Executed: 2015-07-31
CHEN, SHENG-CHAU
Executed: 2015-07-15
YAUNG, DUN-NIAN
Executed: 2015-08-05
HUNG, FENG-CHI
Executed: 2015-07-15
LIN, YUNG-LUNG
Executed: 2015-07-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hybrid Bond Pad Structure