Patent Assignment
Reel/Frame 048735/0500
Assignment of Assignor's Interest
Recorded: 2019-03-29
Pages: 7
Assignors
LEE, DAE-SUK
Executed: 2019-01-08
LEE, HAK-SEUNG
Executed: 2019-01-08
LIM, DONG-CHAN
Executed: 2019-01-08
KIM, TAE-SEONG
Executed: 2019-01-08
MOON, KWANG-JIN
Executed: 2019-01-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips and Methods of Manufacturing the Same