Patent Assignment
Reel/Frame 048748/0790
Assignment of Assignor's Interest
Recorded: 2019-03-31
Pages: 7
Assignors
JANG, JAEGWON
Executed: 2019-02-12
LEE, SEOKHYUN
Executed: 2019-02-12
SUK, KYOUNG LIM
Executed: 2019-03-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same