Patent Assignment
Reel/Frame 048750/0827
Assignment of Assignor's Interest
Recorded: 2019-04-01
Pages: 3
Assignors
NAKAGAWA, KAZUYUKI
Executed: 2018-12-28
BABA, SHINJI
Executed: 2018-12-28
KOIZUMI, HIROSHI
Executed: 2019-01-09
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Including Semiconductor Chip Transmitting Signals at High Speed