Patent Assignment
Reel/Frame 048757/0169
Assignment of Assignor's Interest
Recorded: 2019-04-01
Pages: 4
Assignors
HUNG, WENSEN
Executed: 2019-03-12
CHEN, TSUNG-YU
Executed: 2019-03-12
LIN, TSUNG-SHU
Executed: 2019-03-12
LAO, CHEN-HSIANG
Executed: 2019-03-12
WEI, WEN-HSIN
Executed: 2019-03-12
HU, HSIEN-PIN
Executed: 2019-03-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method and Equipment for Forming the Same