Patent Assignment
Reel/Frame 048769/0869
Assignment of Assignor's Interest
Recorded: 2019-04-02
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2019-03-22
CHEN, MING-FA
Executed: 2019-03-22
HU, CHIH-CHIA
Executed: 2019-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Structure of Dies with Dangling Bonds