Patent Assignment
Reel/Frame 048784/0854
Assignment of Assignor's Interest
Recorded: 2019-04-03
Pages: 3
Assignor
CHAKIHARA, HIRAKU
Executed: 2019-01-23
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same