Patent Assignment
Reel/Frame 048793/0574
Assignment of Assignor's Interest
Recorded: 2019-04-04
Pages: 5
Assignors
NISHIDA, YOSHITERU
Executed: 2019-03-18
IIDA, HIDEKAZU
Executed: 2019-03-18
YOKOO, SUSUMU
Executed: 2019-03-18
TAKAHASHI, HIROYUKI
Executed: 2019-03-18
CHITO, KENTA
Executed: 2019-03-18
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Method