Patent Assignment
Reel/Frame 048794/0703
Assignment of Assignor's Interest
Recorded: 2019-04-04
Pages: 4
Assignors
TUNG, CHIH-HANG
Executed: 2019-03-18
SHAO, TUNG-LIANG
Executed: 2019-03-08
YANG, SU-CHUN
Executed: 2019-03-11
CHANG, GENG-MING
Executed: 2019-03-18
YU, CHEN-HUA
Executed: 2019-03-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure and Method for Forming the Same