Patent Assignment
Reel/Frame 048812/0203
Assignment of Assignor's Interest
Recorded: 2019-04-06
Pages: 7
Assignors
HOR, JOON TEIK
Executed: 2019-03-19
SONG, TING LOK
Executed: 2019-04-05
WAGH, MAHESH
Executed: 2019-04-02
LIM, SU WEI
Executed: 2019-03-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Virtualized Link States of Multiple Protocol Layer Package Interconnects