Patent Assignment
Reel/Frame 048822/0583
Assignment of Assignor's Interest
Recorded: 2019-04-08
Pages: 4
Assignors
PAPALIA, JOHN M.
Executed: 2019-04-08
MIYAZOE, HIROYUKI
Executed: 2019-04-08
MARCHACK, NATHAN P.
Executed: 2019-04-08
ENGELMANN, SEBASTIAN ULRICH
Executed: 2019-04-08
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Layer-By-Layer Etching of Poly-Granular Metal-Based Materials for Semiconductor Structures