Patent Assignment
Reel/Frame 048848/0336
Assignment of Assignor's Interest
Recorded: 2019-04-10
Pages: 4
Assignors
OISHI, HIROKI
Executed: 2019-02-14
OSADA, SHOICHI
Executed: 2019-02-15
YOKOTA, RYUHEI
Executed: 2019-02-15
HIROKAMI, MUNENAO
Executed: 2019-02-15
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor-Encapsulating Epoxy Resin Composition and Semiconductor Device