Patent Assignment
Reel/Frame 048856/0747
Assignment of Assignor's Interest
Recorded: 2019-04-11
Pages: 4
Assignor
LEE, SOO-HWAN
Executed: 2019-04-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Solder Member Mounting Method and System