IP Library Assignment 048864/0554
Patent Assignment
Reel/Frame 048864/0554

Assignment of Assignor's Interest

Recorded: 2019-04-11 Pages: 4
Assignors
KIM, WOON CHUN
Executed: 2019-02-12
PARK, JUN HEYOUNG
Executed: 2019-02-12
SHIM, JI HYE
Executed: 2019-02-12
PARK, SUNG KEUN
Executed: 2019-02-12
LEE, GUN
Executed: 2019-02-12
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 16/291,621 →
Publication: US 2020/0105703
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →